Shenzhen Hengstar Technology Co., Ltd.

Shenzhen Hengstar Technology Co., Ltd.

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Shenzhen Hengstar Technology Co., Ltd.
HomeAwọn ọjaAwọn ẹya ẹrọ Smart Clam ile-iṣẹDDR3 UDIMM Awọn akoko pataki

DDR3 UDIMM Awọn akoko pataki

Iru owo sisan:
L/C,T/T,D/A
Incoterm:
FOB,EXW,CIF
Min. Bere fun:
1 Piece/Pieces
Iṣowo:
Ocean,Air,Express,Land
  • Ọja Apejuwe
Overview
Awọn eroja Ọja

Aṣeṣe No.NSO4GU3AB

Ipese Agbara & Awọn ifitonileti Afikun

IṣowoOcean,Air,Express,Land

Iru owo sisanL/C,T/T,D/A

IncotermFOB,EXW,CIF

Apoti & Ifijiṣẹ
Ta sipo:
Piece/Pieces

4GB 1600mHz 240-PIN DDR3 UDImm


Itan atunyẹwo

Revision No.

History

Draft Date

Remark

1.0

Initial Release

Apr. 2022

 

Pabo tabili tabili

Model

Density

Speed

Organization

Component Composition

NS04GU3AB

4GB

1600MHz

512Mx64bit

DDR3 256Mx8 *16


Isapejuwe
Hengstar ko ko dẹkun DDR3 Sdram Stram (ti a ko fi agbara silẹ Double Meji awọn modulu iranti ni ila-giga) awọn modulu iranti DDR3 ti o lo awọn ẹrọ SDR3. NS04Gab jẹ 512m X 64-bit meji-bi bit meji drrd3-1600 C11 1.5V SDRMA DRRUM SCRAM, ti o da lori awọn paati mẹrinla 256m x 8-bit Fbga. SPD ti ṣe agbekalẹ si Jedec Boṣewa DDR3-1600 Akoko ti 11-11-11-11-11-11 ni 1.5V. Kọọkan 30-bamm n lo awọn ika ọwọ awọn olubasọrọ goolu. Srdram ko ṣee ṣe Dipọmm ti pinnu fun lilo bi iranti akọkọ nigbati a fi sori ẹrọ ni awọn eto bii awọn PC ati awọn iṣẹ.


Awọn ẹya
Ipese agbara: VDD = 1.5V (1.425v si 1.575v)
vdq = 1.5V (1.425v si 1.575v)
800MHz FCK fun 1600MB / iṣẹju-aaya / Pin
8 ominira banki
AKIYESI rocrogramations Stprogragrammable: 11, 10, 9, 8, 7, 6, 6, 6, 6
prography Admic Admidict: 0, CL - 2, tabi CL - 1 Aago
8-bit de-ri
Akoko ipari: 8 (interloveseeve laisi eyikeyi opin, leralera pẹlu adirẹsi "000" nikan), 4 pẹlu TcCD laipe
-itọsọna data
ternal (ti ara) ijuwe; Isamisi ara ẹni ti inu nipasẹ ZQ PIN (RZQ: 240 Ohm ± 1%)
on ku ifopinsi lilo PIN PIN
arage akoko 7.8us ni isalẹ ju TUS 85 ° C, 3.9us ni 85 ° C <T
Tun atunto Tun
Agbara awakọ data ti iṣelọpọ data
O ly-nipasẹ torology
pcb: iga 1.18 "(30mm)
Awọn ifarahan roo ati halogen-free


Awọn ọna kika akoko

MT/s

tRCD(ns)

tRP(ns)

tRC(ns)

CL-tRCD-tRP

DDR3-1600

13.125

13.125

48.125

2011/11/11


Tabili adirẹsi

Configuration

Refresh count

Row address

Device bank address

Device configuration

Column Address

Module rank address

4GB

8K

32K A[14:0]

8 BA[2:0]

2Gb (256 Meg x 8)

1K A[9:0]

2 S#[1:0]


Awọn apejuwe PIN

Symbol

Type

Description

Ax

Input

Address inputs: Provide the row address  for ACTIVE commands, and the column
address and auto precharge bit (A10) for READ/WRITE commands, to select one location
out of the memory array in the respective bank. A10 sampled during a PRECHARGE
command determines whether the PRECHARGE applies to one bank (A10 LOW, bank
selected by BAx) or all banks (A10 HIGH). The address inputs also provide the op-code
during a LOAD MODE command. See the Pin Assignments table for density-specific
addressing information.

BAx

Input

Bank address inputs: Define the device bank to which an ACTIVE, READ, WRITE, or
PRECHARGE command is being applied. BA define which mode register (MR0, MR1,
MR2, or MR3) is loaded during the LOAD MODE command.

CKx,
CKx#

Input

Clock: Differential clock inputs. All control, command, and address input signals are
sampled on the crossing of the positive edge of CK and the negative edge of CK#.

CKEx

Input

Clock enable: Enables (registered HIGH) and disables (registered LOW) internal circuitry
and clocks on the DRAM.

DMx

Input

Data mask (x8 devices only): DM is an input mask signal for write data. Input data is
masked when DM is sampled HIGH, along with that input data, during a write access.
Although DM pins are input-only, DM loading is designed to match that of the DQ and DQS pins.

ODTx

Input

On-die  termination:  Enables  (registered  HIGH)  and  disables  (registered  LOW)
termination resistance internal to the DDR3 SDRAM. When enabled in normal operation,
ODT is only applied to the following pins: DQ, DQS, DQS#, DM, and CB. The ODT input will be ignored if disabled via the LOAD MODE command.

Par_In

Input

Parity input: Parity bit for Ax, RAS#, CAS#, and WE#.

RAS#,
CAS#,
WE#

Input

Command inputs: RAS#, CAS#, and WE# (along with S#) define the command being
entered.

RESET#

Input
(LVCMOS)

Reset: RESET# is an active LOW asychronous input that is connected to each DRAM and
the registering clock driver. After RESET# goes HIGH, the DRAM must be reinitialized as
though a normal power-up was executed.

Sx#

Input

Chip select: Enables (registered LOW) and disables (registered HIGH) the command
decoder.

SAx

Input

Serial address inputs: Used to configure the temperature sensor/SPD EEPROM address
range on the I2C bus.

SCL

Input

Serial
communication to and from the temperature sensor/SPD EEPROM on the I2C bus.

CBx

I/O

Check bits: Used for system error detection and correction.

DQx

I/O

Data input/output: Bidirectional data bus.

DQSx,
DQSx#

I/O

Data strobe: Differential data strobes. Output with read data; edge-aligned with read data;
input with write data; center-alig

SDA

I/O

Serial
sensor/SPD EEPROM on the I2C bus.

TDQSx,
TDQSx#

Output

Redundant data strobe (x8 devices only): TDQS is enabled/disabled via the LOAD
MODE command to the extended mode register (EMR). When TDQS is enabled, DM is
disabled and TDQS and TDQS# provide termination resistance; otherwise, TDQS# are no
function.

Err_Out#

Output (open
drain)

Parity error output: Parity error found on the command and address bus.

EVENT#

Output (open
drain)

Temperature event: The EVENT# pin is asserted by the temperature sensor when critical
temperature thresholds have been exceeded.

VDD

Supply

Power supply: 1.35V (1.283–1.45V) backward-compatible to 1.5V (1.425–1.575V). The
component VDD and VDDQ are connected to the module VDD.

VDDSPD

Supply

Temperature sensor/SPD EEPROM power supply: 3.0–3.6V.

VREFCA

Supply

Reference voltage: Control, command, and address VDD/2.

VREFDQ

Supply

Reference voltage: DQ, DM VDD/2.

VSS

Supply

Ground.

VTT

Supply

Termination voltage: Used for control, command, and address VDD/2.

NC

No connect: These pins are not connected on the module.

NF

No function: These pins are connected within the module, but provide no functionality.

Awọn akọsilẹ : Tabili Apejuwe PIN ni isalẹ jẹ atokọ okeerẹ ti gbogbo awọn pinni ti o ṣeeṣe fun gbogbo awọn modulu DDR3. Gbogbo awọn pinni ti a ṣe akojọ le Ko ni atilẹyin lori module yii. Wo awọn iṣẹ iyansilẹ fun alaye ni pato si module yii.


Ṣiṣẹpọ Iṣeduro Iṣeduro Iṣẹ

4GB, 512mx64 module (2ran ti x8)

1


2


AKIYESI:
1.A rogogo Zq lori paati DDR3 kọọkan ni asopọ si ita 240sẹ ± 1% spororo ti o ti so si ilẹ. O ti lo fun isamisi ti ifori ifori ati awakọ ti o pọju.



Awọn iwọn module


Ifiranṣẹ iwaju

3

Ifiranṣẹ iwaju

4

Awọn akọsilẹ:
Awọn iwọn 1.Lill wa ni milimita (awọn inṣis); Max / min tabi aṣoju (tẹ) ti ko ṣe akiyesi.
2. Ulelerice lori gbogbo awọn iwọn ± 0.15mm ayafi ti bibẹẹkọ ti pàtó kan.
3. Nagram onisopọ jẹ fun itọkasi nikan.

Ọja Isori : Awọn ẹya ẹrọ Smart Clam ile-iṣẹ

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